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Octavo Systems OSD335x-SM Industrial Rated System-in-Package (SiP) provides OEM and system developers the added benefit of the full industrial temperature range (-40°C to 85°C). This SiP integrates the powerful 1GHz ARM® Cortex®-A8 Sitara™ processor from Texas Instruments, DDR3 memory, 2 power supplies, and passives into a single robust BGA package. This integration speeds up the design cycle and removes the need for complicated DDR Routing and power sequencing. The OSD335x industrial SiP is the easiest way to develop an Embedded Linux System for applications requiring a wide temperature range. This SiP gives designers the ability to tailor the device to meet their needs while using a very small 256-ball BGA form factor.
The industrial-rated version of the OSD335x-SM is footprint and software compatible with the established OSD3358-512M-BSM Commercial version. This means all existing reference designs and development tools already support the new OSD335x-SM Industrial device. This also allows a design using the commercial version to be easily upgraded to an industrial rating with a simple BoM change. The BGA package design can reduce PCB layers lowering cost and speeding time to market. This implementation is 60% smaller than using discrete components.
Integrated into a single BGA Package:
Texas Instruments Sitara™ AM335x ARM® Cortex®-A8 Processor
Up to 1GB DDR3L Memory
TPS65217C Power Management IC (PMIC)
TL5209 LDO
4KB EEPROM
Passives
TI AM335x Features:
Up to 1GHz
8 Channel 12-bit SAR ADC
Ethernet 10/100/1000 x2
USB 2.0 HS OTG + PHY x2
MMC, SD, and SDIO x3
LCD controller
SGX 3D graphics engine
PRU subsystem
Access to all AM335x peripherals
CAN, SPI, UART, I2C, and GPIO
Power In:
AC adapter, USB, or single cell (1S) Li-Ion/Li-Po battery
Power Out:
1.8V, 3.3V, and SYS (switched VIN)
1.8V or 3.3V selectable AM335x I/O voltage
Benefits:
Integrates over 100 components into one package
60% reduction in board space vs discrete implementation
Compatible with AM335x development tools and software
Wide BGA ball pitch allows for low-cost assembly
Significantly reduces design time
Decreases layout complexity
Increased reliability through the reduced number of component
Package Info:
21mm x 21mm BGA
256 balls (16 x 16 grid) with 1.27mm pitch
-40°C to 85°C operating temperature range
OSD3358-512M-ISM制造商: Octavo Systems
产品种类: 模块化系统 - SOM
系列: OSD3358
外观尺寸: SiP
处理器品牌: Texas Instruments
处理器类型: TI AM335x
频率: 1 GHz
存储容量: 512 MB
接口类型: CAN, Ethernet, I2C, Serial, UART, USB
工作电源电压: 5 V
最大工作温度: + 85 C
尺寸: 21 mm x 21 mm
存储类型: DDR3
商标: Octavo Systems
高速缓冲存储器: 32 kB, 32 kB, 256 kB
最小工作温度: - 40 C
产品类型: System-On-Modules - SOM
子类别: Computing
OSD3358-512M-ISM
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