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说明
The MAX20317 is an I2C controllable, universal 3.5mmØ accessory management IC. The device provides a universal jack interface solution, as well as a compact solution for the power management and interface control of a powered accessory, such as an active noise cancelling (ANC) headset.
The MAX20317 automatically measures headset impedance with a high precision, triple current source 8 bit ADC. After impedance detection, the device also detects when a headset is in a CTIA or OMTP configuration and automatically configures the SLEEVE and RING2 terminals to correctly connect the microphone and ground lines.
When a boost supply is applied, the MAX20317 can detect the presence of an ANC headset. When the ANC headset is detected and enabled, a button-press monitoring circuit activates and flags button presses by detecting the voltage drop across a sense resistor.
The MAX20317 provides a power line communication tool to a headset to exchange the data with the host device.
The MAX20317 has the two separate ground sense inputs from the SLEEVE and RING2 terminals of the connector to provide a high ground isolation to the audio codec.
The MAX20317 is available in a space-saving, 20-bump, 0.4mm pitch, 1.65mm x 2.05mm wafer-level package (WLP) and operates over the -40°C to +85°C extended temperature range.
关键特性
Allows Wide Range of Applications by Supporting Universal 3.5mm Jack Types
Auto-Configuration for CTIA and OMTP Headsets
Supports MEMS Microphone
50mΩ Ground Switch
Enables Long Utilization of Accessories by Supplying Power Through 3.5mm Jack
Powered Accessory/Headset Detection
Bypass Switch to Power Accessories, Such as ANC Headsets
Programmable Button Detection in Powered Accessory Mode
Empowers New Path in Data Communication to Accessories
Power Line Communication by 3.5mm Jack
Bidirectional Digital Data Communication in Power Mode
Allow Emergence of New Accessory Types
Provides Comfortable Sounds by Introducing Automatic Volume Adjustment
Adaptive Volume Control Based on Precision Headset Impedance
False Insertion Detection
Saves Board Space with Small Form Factor
1.65mm x 2.05mm 4 x 5 Array 20-Bump 0.4mm Pitch WLP
应用
笔记本PC
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智能电话
平板PC
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